1/8 www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. moter drivers for printers motor drivers with brush for printers BD63821EFV, bd63823efv description BD63821EFV/bd63823efv series are built-in 2 channel h-brid ge circuits that can drive 2pcs dc brush motor or 1pcs stepping motor. these drivers facilitate low power consumption by t he direct pwm or pwm constant current control. feature 1) single power supply input (rated voltage of 36v) 2) rated output current (peak): 1.0a(1.5a), 2.0a(2.8a) 3) low on resistance dmos output 4) forward, reverse, brake, open 5) power save function 6) external pwm control 7) pwm constant current cont rol (current limit function) 8) built-in spike noise cancel function (external noise filter is unnecessary) 9) driver for 2 dc brush motor 10) driver for 1 stepping motor 11) full step, half step (driving stepping motor) 12) step drive by external dac (driving stepping motor) 13) built-in logic input pull-down resistor 14) cross-conduction prevention circuit 15) signal output of detecting the motor lock state (wired-or) 16) signal output of detecting the abnormal states (wired-or) 17) thermal shutdown circuit (tsd) 18) over current protection circuit (ocp) 19) under voltage lock out circuit (uvlo) 20) over voltage lock out circuit (ovlo) 21) ghost supply prevention (protects against ma lfunction when power supply is disconnected) 22) electrostatic discharge: 8kv (hbm specification) 23) adjacent pins short protection 24) inverted mounting protection 25) microminiature, ultra-thin and high heat-radiation (exposed metal type) htssop-b28 package 26) pin-compatible line-up application ppc, multi-function printer, laser beam printer, ink jet pr inter, monitoring camera, web camera, sewing machine, photo printer, fax, scanner, mini printer, toy, and robot etc. no.12010eat06
technical note 2/8 BD63821EFV, bd63823efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. absolute maximum ratings (ta=25c) item symbol bd63823 bd63821 unit supply voltage v cc1,2 -0.3~+36.0 v power dissipation pd 1.45 1 w 4.70 2 w input voltage for control pin v in -0.3~+7.0 v rnf maximum voltage v rnf 0.7 v output current i out 2.0 3 1.0 3 a/ch output current (peak) 4 i outpeak 2.8 3 1.5 3 a/ch fault, lock voltage v fault -0.3~7.0 v fault, lock current i fault 5 ma operating temperature range t opr -25~+85 c storage temperature range t stg -55~+150 c junction temperature t jmax +150 c 1 70mm70mm1.6mm glass epoxy board. derating in done at 11.6mw/c for operating above ta=25c. 2 4-layer recommended board. derating in done at 37.6mw/c for operating above ta=25c. 3 do not, however exceed pd, aso and tjmax=150c. 4 pulse width tw Q 20ms operating conditions (ta= -25~+85c) electrical characteristics (unless otherwise specified ta=25c, v cc1.2 =24v) item symbol limit unit condition min. typ. max. whole circuit current at standby i ccst - 1.0 2.5 ma ps=0v circuit current i cc - 2.5 5.0 ma ps=in1a=in1b=5v control input (in1a, in1b, in2a, in2b, ps) h level input voltage v inh 2.0 - - v l level input voltage v inl - - 0.8 v h level input current i inh 35 50 100 a v in =5v l level input current i inl -10 0 - a v in =0v fault lock output (fault, lock) output low voltage v fault - 50 100 mv i fault =1ma output leak current i fault_leak - - 10 a v fault =5v output (out1a, out1b, out2a, out2b) output on resistance (bd63823efv) r on - 0.65 0.90 ? i out =1.5a,sum of upper and lower output on resistance (BD63821EFV) r on 1.90 2.50 ? i out =0.5a,sum of upper and lower output leak current i leak - - 10 a current control rnfxs input current i rnfs -2.0 -0.1 - a rnfxs=0v rnfx input current i rnf -40 -20 - a rnfx=0v vref input current i vref -2.0 -0.1 - a vrefx=0v vref input voltage range v ref 0 - 3.0 v minimum on time (blank time) t onmin 0.7 1.5 3.0 s current limit comparator threshold v cth 0.57 0.60 0.63 v vrefx=3v item symbol min. typ. max. unit supply voltage v cc1,2 19 24 28 v input voltage for control pin v in 0 - 5.5 v pwm input frequency f in - - 100 khz
technical note 3/8 BD63821EFV, bd63823efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. terminal function and application circuit diagram pin no. pin name function pin no. pin name function 1 gnd ground terminal 15 lock motor lock signal output terminal 2 out1b h bridge output terminal 16 in1a h bridge control terminal 3 rnf1 connection terminal of resistor for output current detection 17 in1b h bridge control terminal 4 rnf1s input terminal of current limit comparator 18 test terminal for testing 5 out1a h bridge output terminal 19 in2a h bridge control terminal 6 nc non connection 20 in2b h bridge control terminal 7 vcc1 power supply terminal 21 nc non connection 8 nc non connection 22 vcc2 power supply terminal 9 gnd ground terminal 23 nc non connection 10 cr connection terminal of cr for setting chopping frequency 24 out2a h bridge output terminal 11 vref1 current limit value setting terminal 25 rnf2s input terminal of current limit comparator 12 vref2 current limit value setting terminal 26 rnf2 connection terminal of resistor for output current detection 13 ps power save terminal 27 out2b h bridge output terminal 14 fault fault signal output terminal 28 nc non connection application circuit diagram constant voltage control or external pwm contro l (when not using the motor lock detection function) fig.1application circuit diagram of constant voltage control or external pwm control (when not using the motor lock detection function) m m terminal for testing connect to gnd. bypass capacitor. setting range is 100uf~470uf(electrolytic) 0.01uf~0.1uf(multilayer ceramic etc.) be sure to short vcc1 & vcc2. control input terminal. predriver 7 vcc1 uvlo regulator 16 in1 a 17 in1b vref1 11 2 out1b 5 out1a 3 rnf1 22 vcc2 24 out2a 1,9 gnd 27 out2b 26 rnf2 control logic osc ovlo rnf1s 100f 0.1f 19 in2 a 20 in2b forward reverse brake open forward reverse brake open 14 fault 4 rnf1s 25 rnf2s cr 10 18 test 13 ps when using the fault output function ? pull up resistor 5k ? ~100k ? . not using ? connect to gnd. 3.3v or 5.0v 10k ? 1/5 vref2 12 rnf2s 1/5 blank time pwm control tsd ocp 15 lock power save terminal
technical note 4/8 BD63821EFV, bd63823efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. points to noti ce for terminal description ps/ power save terminal ps can make circuit standby state and make motor output open please be careful of delay 40 s(max.) before it is returned from off state to normal state. ps state l power save (standby) h active in1a,i n1b, in2a, in2b/ h bridge control terminal input output state ps in1a in2a in1b in2b out1a out2a out1b out2b l x x open open power save (standby) h l l open open stop h h l h l forward h l h l h reverse h h h l l brake x: h or l protection circuits thermal shutdown (tsd) this ic has a built-in thermal shutdown circuit for therma l protection. when the ic?s chip temperature rises above 175 c (typ.), the motor output becomes open. also , when the temperature returns to under 150 c (typ.), it automatically returns to normal operation. however, even when tsd is in oper ation, if heat is continued to be added externally, heat overdrive can lead to destruction. over current protection (ocp) this ic has a built in over current prot ection circuit as a provision against destr uction when the motor outputs are shorted each other or vcc-motor output or motor output-gnd is shorted. this circuit la tches the motor outpu t to open condition when the regulated threshold current flows for 4 s (typ.). it returns with power reacti vation or a reset of the ps terminal. the over current protection circuit?s only aim is to prevent the destruction of the ic from irr egular situations such as motor output shorts, and is not meant to be used as protection or security for the set. therefore, sets should not be designed to take into account this circuit?s functions. after ocp operating, if irregular situations continues and the return by power reactivation or a reset of the ps terminal is carried out repeatedly, then ocp operates repeatedly and the ic may generate heat or otherwise dete riorate. when the l value of t he wiring is great due to the wi ring being long, after the over current has flowed and the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there is a possibility of destruction. also, when curr ent which is over the output current rating and under the ocp detection current flows, the ic can heat up to over tjmax=150 c and can deteriorate, so current which exceeds the output rating should not be applied. under voltage lock out (uvlo) this ic has a built-in under voltage lock out function to prev ent false operation such as ic output during power supply under voltage. when the applied voltage to the vcc terminal go es under 15v (typ.), the motor output is set to open. this switching voltage has a 1v (typ.) hysteresis to prevent fals e operation by noise etc. pleas e be aware that this circuit does not operate during power save mode. over voltage lock out (ovlo) this ic has a built-in over voltage lock out function to pr otect the ic output and the motor during power supply over voltage. when the applied voltage to the vcc terminal goes ov er 32v (typ.), the motor output is set to open. this switching voltage has a 1v (typ.) hysteresis and a 4 s (typ.) mask time to prevent fals e operation by noise etc. although this over voltage locked out circuit is built -in, there is a possibility of destructi on if the absolute maximum value for power supply voltage is exceeded, therefore t he absolute maximum value should not be exceeded. please be aware that this circuit does not operate during power save mode. ghost supply prevention (protects against malfunction when power supply is disconnected) if a signal (in1a, in1b, in2a, in2b, ps, vref1, vref2) is i nput when there is no power suppl ied to this ic, there is a function which prevents the false operat ion by voltage supplied via the electrostatic destruction prevention diode from these input terminals to the vcc to this ic or to another ic ?s power supply. therefore, there is no malfunction of the circuit even when voltage is supplied to these input terminals while there is no power supply.
technical note 5/8 BD63821EFV, bd63823efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. thermal derating curve htssop-b28 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. also, the back of board as well as the surfaces has large areas of c opper foil heat dissipation patterns, greatly increasing power dissipation. the back metal is shorted with the back side of the ic chip, being a gnd potential, therefore there is a possibility for malfunction if it is shorted with any potential other than gnd, which should be avoided. also, it is recommended that the back metal is solder ed onto the gnd to short. please note that it has been assumed that this product will be used in the condition of this back metal perfo rmed heat dissipation treatment for increasing heat dissipation efficiency. fig. 2 htssop-b28 thermal derating curve ambient temperature:ta[c] power dissipation pd[w] 1.0 100 125 0 4.70w 4 3.30w 3 1.85w 2 1.45w 1 2.0 3.0 4.0 5.0 measurement machine th156 kuwano electric measurement condition rohm board board size 70mm*70mm*1.6mm (with through holes on the board) the exposed metal of the backside is connected to the board with solder. board ? 1-layer board (copper foil on the back 0mm) board ? 2-layer board (copper foil on the back 15mm*15mm) board ? 2-layer board (copper foil on the back 70mm*70mm) board ? 4-layer board (copper foil on the back 70mm*70mm) board ? ja =86.2c/w board ? ja =67.6c/w /w board ? ja =37.9c/w board ? ja =26.6c/w 50 25 85 75 150
technical note 6/8 BD63821EFV, bd63823efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. operation notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify br eaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute ma ximum ratings, consider adding circuit protection devices, such as fuses. (2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3) power supply lines as return of current regenerated by back emf of fet out put happens, take steps such as putting capacitor between power supply and gnd as an electric pathway for the regener ated current. be sure that there is no problem with each property such as emptied capacity at lo wer temperature regarding electrolytic capacitor to decide capacity value. if the connected power supply does not have suff icient current absorption capacity, rege nerative current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. it is recommended to implement a physical safety measure such as the insertion of a voltage clamp diode between the power supply and gnd pins. (4) gnd potential the potential of gnd pin must be minimu m potential in all operating conditions. (5) metal on the backside (define the side w here product markings are printed as front) the metal on the backside is shorted with the backside of ic ch ip therefore it should be connec ted to gnd. be aware that there is a possibility of malfunction or destruction if it is shorted wi th any potential other than gnd. (6) thermal design use a thermal design that allows for a suffic ient margin in light of the power dissipa tion (pd) in actual operating conditions. this ic exposes the metal on the backside of package. note t hat this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. (7) inter-pin shorts and mounting errors when attaching to a printed circuit board, pay close attention to the direction of the ic and displacement. improper attachment may lead to destruction of the ic. there is also possibility of destruction from short circuits which can be caused by foreign matter entering between out puts or an output and the power supply or gnd. (8) operation in strong electromagnetic field use caution when using the ic in the presence of a strong electr omagnetic field as doing so may cause the ic to malfunction. (9) aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (10) thermal shutdown circuit the ic has a built-in thermal shutdown circuit (tsd circuit) . if the chip temperature bec omes tjmax=150c, and higher, coil output to the motor will be open. the tsd circuit is des igned only to shut the ic of f to prevent runaway thermal operation. it is not designed to protect or indemnify peri pheral equipment. do not use the tsd function to protect peripheral equipment. tsd on temperature [c] (typ.) hyst eresis temperature [c] (typ.) 175 25 (11) over current protection circuit the ic has a built-in over current protecti on circuit (ocp circuit). the ocp circuit is designed only to shut the ic off to prevent abnormal situations, when absolute maximum output current is exceeded. it is not designed to protect or indemnify peripheral equipment. do not use the ocp function to protect peripheral equipment. (12) inspection of the application board during inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the ic, t herefore an electrical discharge should be performed after each process. also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. furthermore, when connecti ng to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection.
technical note 7/8 BD63821EFV, bd63823efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. (13) input terminal of ic this ic is a monolithic ic, and between each element there is a p+ isolation for element partition and a p substrate. this p layer and each element?s n layer make up the p-n junction, and various parasitic elements are made up. for example, when the resistance and transistor are connected to the terminal as shown in figure 3, when gnd (terminal a) at the resistance and gnd (terminal b) at the transistor (npn), the p-n junction operates as a parasitic diode. also, when gnd (terminal b) at the transistor (npn) the parasitic npn transistor operates with the n la yers of other elements close to the aforementioned parasitic diode. because of the ic?s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. the operation of parasitic elements causes interference in circ uit operation, and can lead to malfunction and destruction. therefore, be careful not to use it in a way which causes t he parasitic elements to operate, such as by applying voltage that is lower than the gnd (p s ubstrate) to the input terminal. fig. 3 pattern diagram of parasitic element (14) ground wiring pattern when using both large current and small signal gnd patterns , it is recommended to isolate the two ground patterns, placing a single ground point at the gr ound potential of applicatio n so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. (15) test pin be sure to connect test pin to gnd. resistor transistor (npn) n n n p + p + p p substrate gnd pin a n n p + p + p p substrate gnd parasitic element pin b n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element parasitic element b c e
technical note 8/8 BD63821EFV, bd63823efv www.rohm.com 2012.02 - rev. a ? 2012 rohm co., ltd. all rights reserved. ordering part number b d 6 3 8 2 1 ef v -e 2 ??` efv=htssop-b28 ??`?? e2: `???`? ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape (with dry pack) tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) htssop-b28 0.08 m 0.08 s s 1.0 0.2 0.5 0.15 4 + 6 ? 4 0.17 +0.05 - 0.03 15 28 14 1 (2.9) 4.4 0.1 (5.5) (max 10.05 include burr) 0.625 6.4 0.2 9.7 0.1 1pin mark 1.0max 0.65 0.85 0.05 0.08 0.05 0.24 +0.05 - 0.04
r1120 a www.rohm.com ? 2012 rohm co., ltd. all rights reserved. notice rohm customer support system http://www.rohm.com/contact/ thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of rohm co.,ltd. the content specied herein is subject to change for improvement without notice. the content specied herein is for the purpose of introducing rohm's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specications, which can be obtained from rohm upon request. examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specied in this document. however, should you incur any damage arising from any inaccuracy or misprint of such information, rohm shall bear no responsibility for such damage. the technical information specied herein is intended only to show the typical functions of and examples of application circuits for the produc ts. rohm does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm and other parties. rohm shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. the products specied in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, ofce-automation equipment, commu- nication devices, electronic appliances and amusement devices). the products specied in this document are not designed to be radiation tolerant. while rohm always makes efforts to enhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, re or any other damage caused in the event of the failure of any product, such as derating, redundancy, re control and fail-safe designs. rohm shall bear no responsibility whatsoever for your use of any product outside of the prescribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel- controller or other safety device). rohm shall bear no responsibility in any way for use of any of the products for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or technology specied herein that may be controlled under the foreign exchange and the foreign trade law, you will be required to obtain a license or permit under the law.
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